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01352nam a2200373Ia 4500 |
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EBC773636 |
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MiAaPQ |
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20200520144314.0 |
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m o d | |
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cr cn||||||||| |
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101002s2011 flua sb 000 0 eng d |
| 020 |
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|z 1439862052
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| 020 |
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|z 9781439862056
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| 035 |
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|a (MiAaPQ)EBC773636
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|a (Au-PeEL)EBL773636
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|a (CaPaEBR)ebr10495995
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| 035 |
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|a (CaONFJC)MIL327460
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|a (OCoLC)756484227
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|a MiAaPQ
|c MiAaPQ
|d MiAaPQ
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| 050 |
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4 |
|a TK7871.85
|b S4675 2011
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| 245 |
0 |
0 |
|a Semiconductor packaging
|h [electronic resource] :
|b materials interaction and reliability /
|c Andrea Chen, Randy Hsiao-Yu Lo.
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| 260 |
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|a Boca Raton :
|b CRC Press,
|c 2011.
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| 300 |
|
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|a xviii, 187 p. :
|b ill.
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| 504 |
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|a Includes bibliographical references.
|
| 533 |
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|a Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
|
| 650 |
|
0 |
|a Semiconductors
|x Reliability.
|
| 650 |
|
0 |
|a Electronic packaging
|x Reliability.
|
| 650 |
|
0 |
|a Materials science.
|
| 650 |
|
0 |
|a Electrical engineering.
|
| 655 |
|
4 |
|a Electronic books.
|
| 700 |
1 |
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|a Chen, Andrea.
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| 700 |
1 |
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|a Lo, Randy.
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| 710 |
2 |
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|a ProQuest (Firm)
|
| 856 |
4 |
0 |
|u https://ebookcentral.proquest.com/lib/matrademy/detail.action?docID=773636
|z Click to View
|
