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Semiconductor packaging materials interaction and reliability /

Bibliographic Details
Corporate Author:	ProQuest (Firm)
Other Authors:	Chen, Andrea., Lo, Randy.
Format:	Electronic eBook
Language:	English
Published:	Boca Raton : CRC Press, 2011.
Subjects:	Semiconductors > Reliability. Electronic packaging > Reliability. Materials science. Electrical engineering. Electronic books.
Online Access:	Click to View

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