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Semiconductor packaging materials interaction and reliability /

Bibliographic Details
Corporate Author: ProQuest (Firm)
Other Authors: Chen, Andrea., Lo, Randy.
Format: Electronic eBook
Language:English
Published: Boca Raton : CRC Press, 2011.
Subjects:
Semiconductors > Reliability.
Electronic packaging > Reliability.
Materials science.
Electrical engineering.
Electronic books.
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